YHJ air bearing spindle
Suitable for ultra-precision machine tools and semiconductor machine tools.
Keywords
Precision grinding, intelligent manufacturing technology, integrated solutions
Classification
Typical Machining Parts
Typical Machining Parts
Optical lenses, grinding of semiconductor wafers.
Equipment Highlights
Equipment Highlights
(1) High precision: ultra-high rotary precision, end face runout, radial runout ≤ 0.3 μm;
(2) Long life: low vibration, no wear;
(3) Low heat: compact air-cooled design, suitable for high-speed applications;
(4) no pollution: no mineral oil pollution;
(5) Personalized customization: ultra-high precision air bearing spindle patented technology, support for personalized customization.
Technical parameters
Technical parameters
(1) High precision: ultra-high rotary precision, end face runout, radial runout ≤ 0.3 μm;
(2) The radial stiffness and axial stiffness of the main shaft with a housing diameter of 148mm are ≥ 70N/um;
(3) The shell size and grinding head size can be customized according to the use requirements.
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